Through glass vias substrate is a new glass substrate, which make holes through thin glass without damaging glass shape. A through-glass via (TGV) provides a vertical electrical connection through a glass substrate.
Market Analysis and Insights: Global Through Glass Via (TGV) Substrate Market The global Through Glass Via (TGV) Substrate market was valued at US$ XX in 2020 and will reach US$ XX million by the end of 2027, growing at a CAGR of XX% during 2022-2027.
Global Through Glass Via (TGV) Substrate Scope and Market Size The global Through Glass Via (TGV) Substrate market is segmented by company, region (country), by Type, and by Application.